ACF Bonding Machine【Consult before placing an order】

Precision ACF (Anisotropic Conductive Film) bonding equipment designed for LCD panels and flexible PCBs, tailored for high-accuracy electronic assembly processes.

Key Features

• Micron-level Alignment：±5μm bonding accuracy for ultra-narrow bezel panels

• Smart Pressure Control：Programmable multi-stage temperature/pressure profiles for varied ACF films

• High-speed Output：800 UPH (for 0.5mm pitch components)

• Auto-Calibration：Built-in CCD vision with real-time material deformation compensation

Applications

• LCD Module Assembly：ACF bonding for smartphone/tablet displays

• FPCB Production：OLED driver IC bonding process

• Microelectronics Packaging：Chip-scale anisotropic conductive interconnects